2026年8月31日至9月2日，第十四届半导体设备材料及核心部件展（CSEAC 2026）将在无锡太湖国际博览中心开幕。由中国电子专用设备工业协会主办的第十四届(2026)中国电子专用设备工业协会半导体设备年会也将同期同地召开。
CSEAC 2026 规模新高：7万平方米，联动1400+海内外展商，同期20+专业论坛、多场圆桌对话、新品发布……校企专区120+产业链企业、知名高校、科研院所集中亮相，汇聚芯成果，链接芯机遇！
亮点速览：
09:30-09:50 开幕式
Opening Ceremony
09:30-09:45
领导、嘉宾致辞
Address by Distinguished Leaders and Guests
09:45-09:50 开幕式
Opening Ceremony
“携手同行”纪录片——第十四届（2026）中国电子专用设备工业协会半导体设备年会开幕
Documentary "Hand‑in‑Hand Forward": Opening of The 14th (2026) CEPEA Semiconductor Equipment Annual Conference
09:50-11:55 主旨报告
Keynote Speech
主旨报告环节主持
主持人：王志越
中国电子专用设备工业协会秘书长
Wang Zhiyue, Secretary-General, CEPEA
09:50-10:15
量子科技体系和产业体系建设
Construction of the quantum technology and industrial system
陆军 中国电子科技集团公司首席科学家
Lu Jun, Chief Scientist, China Electronics Technology Group Corporation
10:15-10:40
AI 引领半导体装备新未来：北方华创的发展战略与前瞻探索
AI Pioneers the Next Era of Semiconductor Equipment: NAURA's Strategy and Prospective Initiatives
董博宇 中国电子专用设备工业协会理事长/北方华创科技集团股份有限公司总裁
Dong Boyu, Chairman, China Electronic Production Equipment Industry Association, President of NAURA Technology Group Co., Ltd.
10:40-11:05
三维闪存架构工艺设备的协同创新与发展
Synergistic Innovation and Development of 3D NAND Flash Architecture, Process and Equipment
霍宗亮 长江存储科技有限责任公司首席科学家
Huo Zongliang, Chief scientific officer, Yangtze Memory Technologies Co., Ltd.
11:05-11:30
主要国家和地区半导体技术发展战略和态势
Semiconductor Technology Development Strategies and Dynamics in Major Countries and Regions
史冬梅 国家自然科学基金委员会高技术研究发展中心原技术总师 二级研究员
Shi Dongmei, Former Chief Technology Engineer High Technology R&D Center, NSFC
11:30-11:55
构建半导体具身智能设备开发范式平台，实现合作共赢
Building a Development Paradigm for Embodied-Intelligence Semiconductor Equipment: Enabling Win-Win Collaboration
黎家俨 合肥晶合集成电路股份有限公司研发AI总负责人
Chiayen Li, Head of AI R&D, Nexchip Semiconductor Corporation
杨洋 北京北方华创微电子装备有限公司软件体系总经理
Yang Yang, General Manager, Software System, Beijing Naura Microelectronics Equipment Co., Ltd.
11:55-13:30 午餐&休息
Lunch & Break
11:30-16:15 产业报告
Industry Report
产业报告环节主持
主持人：张帆博士/教授
中国电子专用设备工业协会副理事长 日联科技集团股份有限公司研究院院长
Professor/Dr. Zhang Fan, Vice Chairman of China Electronic Production Equipment Industry Association, Director of Research Institute of Unicomp Technology (Group) Co., Ltd.
13:30-13:55
芯片制造量检测设备现状与国产化进程
The current situation and localization progress of equipment for IC fabrication metrology and inspection
李晋湘 中国电子专用设备工业协会副秘书长、工信部电子科技委专家委员
Li Jinxiang, Executive Deputy Secretary general of China Electronic Production Equipment Industry Association & Member of the Electronic Science and Technology Committee, MIIT
13:55-14:20
坚持长期主义，以技术创新突破半导体设备行业内卷
Adhere to Long termism and Breakthrough the Internal Competition in the Semiconductor Equipment Industry through Technological Innovation
王燕清 无锡先导智能装备股份有限公司董事长
Wang Yanqing, Chairman, Wuxi Lead Intelligent Equipment Co., Ltd.
14:20-14:45
从“看见”到“预见”
——电子束量检测设备与OPC的协同演进与未来趋势
From Seeing to Predicting
——Synergistic Evolution and Future Trends of E-Beam Metrology & Inspection and OPC
雒晓军 东方晶源微电子科技（北京）股份有限公司高级副总裁
Luo Xiaojun, SVP, Dongfang Jingyuan Electron CO.,LTD.
14:45-15:00企业新品发布专场
Enterprise New Product Launch Session
江苏微导纳米科技股份有限公司：iTomic® MeT 系列原子沉积系统、iTronix® MTP 系列等离子体增强化学气相沉积系统发布
Jiangsu Leadmicro Nano-Technology Co.,Ltd. Releases iTomic® MeT Atomic Layer Deposition (ALD) System and iTronix® MTP Plasma Enhanced Chemical Vapor Deposition (PECVD) System
江苏京创先进电子科技有限公司：JTA-9612全自动减薄抛光贴撕膜一体设备发布
Jiangsu JCA Electronic Technology Co., Ltd. Releases JTA-9612 Fully Automatic Grinding, Polishing and Mounter In-line System
江苏快克芯装备科技有限公司：先进封装热压键合设备（TCB）发布
Quick Semiconductor Technology Co.,Ltd. Releases Advanced Packaging Thermal Compression Bonding (TCB) Equipment
15:00-15:25
AI 浪潮重塑半导体格局：先进工艺革新与盛美差异化创新之路
The AI Revolution Reshaping the Semiconductor Industry: Advanced Process Innovation and ACM’s Differentiated Innovation Strategy
金一诺 盛美半导体设备(上海)股份有限公司工艺副总裁
Jin Yinuo, Vice President of Process Technology, ACM Research (Shanghai), Inc.
15:25-15:50
面向12寸先进集成电路制造的无图形颗粒检测设备的开发与应用
Development and Application of Non-Patterned Particle Inspection Systems for 12-Inch Advanced IC Manufacturing Processes
初新堂 京城中安半导体设备（北京）有限公司市场副总
Seddy Chu, Marketing VP, Jingcheng Zhongan Semiconductor Equipment (Beijing) Co., Ltd.
15:50-16:15
2026上半年中国半导体设备行业经济定性分析
China Semiconductor Equipment Industrial Sector Analysis for the First Half of 2026
王志越 中国电子专用设备工业协会秘书长
Wang Zhiyue, Secretary-General, CEPEA
16:15-17:00 董事长圆桌对话
Chairmen Roundtable Discussion
主题：在韬定律语境中对成熟制程的价值重估
Re‑evaluating the Value of Mature Process in the Context of Tau Scaling Law
主持人：张卫 上海复旦微电子集团股份有限公司董事长兼总经理
Zhang Wei, Chairman and General Manager, Shanghai Fudan Microelectronics Group Co., Ltd.
董博宇 中国电子专用设备工业协会理事长/北方华创科技集团股份有限公司总裁
Dong Boyu, Chairman, China Electronic Production Equipment Industry Association, President of NAURA Technology Group Co., Ltd.
尹志尧 中微半导体设备（上海）股份有限公司董事长兼总经理
Gerald Yin, Chairman & CEO, Advanced Micro-Fabrication Equipment Inc. China
蔡琳 北京华峰测控技术股份有限公司总经理
Linda Cai, CEO, Beijing Huafeng Test & Control Technology Co.,Ltd
刘骏 日联科技集团股份有限公司董事长
Liu Jun, Chairman, UNICOMP TECHNOLOGY GROUP CO.,LTD.
于大全博士 厦门云天半导体科技有限公司董事长兼总经理
Yu Daquan, Chairman & CEO , Xiamen Sky Semiconductor Technology Co.,Ltd.
郑志成 合肥晶合集成电路股份有限公司联席总经理
Mark Zheng, Co-President, Nexchip Semiconductor Corporation
*议程持续更新中，请以现场实际为准
主持人：丛海
中微半导体设备（上海）股份有限公司资深副总裁、全球业务管理部、等离子刻蚀产品总部、外延产品部及介质薄膜产品部总经理
Hai Cong, Senior VP, Global Business Management, General Manager of Etch PBG, EPI and PECVD Division, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
9:30-9:50
中微公司: 精进刻蚀技艺，决胜三维工艺
AMEC: Mastering Etch Technology, Excelling in 3D Processes
王红超 中微半导体设备（上海）股份有限公司 商务拓展与技术市场副总监
Tony Wang, BD&Tech. Marketing Associate Director,Advanced Micro-Fabrication Equipment Inc. China
9:50-10:20
多平台刻蚀能力建设与量产实践
Building Multi-Platform Etch Capability for Mass Production
陈颖儒 重庆芯联微电子有限公司 刻蚀工程处副总监
Terry Chen, Deputy Director of Etching Engineering Department, Chongqing Xinlian Microelectronics Co., Ltd
10:20-10:40
邑文科技刻蚀技术在三代半硅光化合物半导体领域的应用
Application of AMTE Etching Technology in the Field of Third-Generation Silicon Photonic Compound Semiconductors
邓家亮 无锡邑文微电子科技股份有限公司 销售部总经理
Bill Deng, Sales General Manager,Advanced Materials Technology & Engineering Co., Ltd
10:40-11:00
离子束修平在表面超平坦化与梯度刻蚀的应用
Ultra-flat Surface and Gradient Etching for Advanced Application Using Ion Beam Trimming
李自超 江苏鲁汶仪器股份有限公司 技术专家
Zichao Li, Technical Expert, Jiangsu Leuven ainsyruments Co.,Ltd
11:00-11:20
面向高端硅光子芯片制造的前沿尖端解决方案
Cutting-edge Solutions for Advanced SiPho Chip Manufacturing
陈才干 泛林集团 工艺经理
Chris Chen, Process Manager, Lam Research
11:25-12:00 圆桌讨论
Panel Discussion
主持人：李海明
重庆芯联微电子有限公司资深副总经理
Herman Lee, Senior Vice President, Chongqing Xinlian Microelectronics Co., Ltd.
丛海 中微半导体设备（上海）股份有限公司 资深副总裁、全球业务管理部、等离子刻蚀产品总部、外延产品部及介质薄膜产品部总经理
Hai Cong, Senior VP, Global Business Management, General Manager of Etch PBG, EPI and PECVD Division, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
卢合强 华海清科股份有限公司 离子注入工艺技术总监
Jack Lu, Director of Ion Implant Process Technology, Hwatsing Technology Co., Ltd.
董溯 江苏鲁汶仪器股份有限公司 副总经理
Su Dong, Deputy General Manager, Jiangsu Leuven ainsyruments Co.,Ltd
王旭 御微半导体 地区部总经理
Xander Wang, Regional General Manager, Yuwei Semiconductor Technology Co.,Ltd
任连娟 应用材料（中国）有限公司 高级总监
Lianjuan Ren, Senior director,Applied Materials, Inc.
*议程持续更新中，请以现场实际为准
主持人：于大洋
北京诺华资本投资管理有限公司总经理
Alex Yu, General Manager,Beijing NUO Capital Investment Management Co,Ltd
13:30-13:50
先进逻辑与存储器件半导体装备应用与挑战
Application and Challenges of Semiconductor Equipment for Advanced Logic and Memory Devices
许灿 中微半导体设备(上海)股份有限公司金属沉积产品部总经理
Can Xu, GM of metal product division,Advanced Micro-Fabrication Equipment Inc. China
13:50-14:10
集成电路制造中金属化工艺装备的应用与挑战
Metallization Equipment in IC Manufacturing: Applications and Challenges
张钦彤 北京北方华创微电子装备有限公司 MDP事业单元CTO
Qintong Zhang, MDP BU CTO, Beijing NAURA Microelectronics Equipment Co.,Ltd.
14:10-14:30
超保形性介电材料原子层沉积工艺 - 助力国产三维芯片技术开发和应用
Advanced Conformal Dielectric-Material Atomic Layer Deposition (ALD) for 3D-IC Technology Development and Applications
刘武平 拓荆科技（上海）有限公司副总裁
Wuping Liu, PhD,Vice President, Piotech (Shanghai) Co., Ltd
14:30-14:50
面向晶圆制造的前道关键装备：从原子层沉积到离子注入的协同创新
Key Front-End Equipment for Semiconductor Processing: Collaborative Innovation from Atomic Layer Deposition to Ion Implantation
张丛 青岛思锐智能科技股份有限公司首席技术官
Cong Zhang, CTO, Qingdao SRI Intellectual Technology Co., Ltd
14:50-15:10
算力换产能—AI驱动半导体设备与制造的效能革命
Computing Power for Capacity: AI - Driven Efficiency Revolution in Semiconductor Equipment & Manufacturing
吴启明 合肥晶合集成电路股份有限公司资深处长
Ryan Wu, Senior Director, Nexchip Semiconductor Corporation
15:10-15:30
High-k材料在逻辑器件的应用
Applications of High-k Materials in Logic Semiconductor Devices
符腾飞 江苏微导纳米科技股份有限公司专家工程师
Tengfei Fu, Expert Engineer, Jiangsu Leadmicro Nano-Technology Co.,Ltd
15:30-15:50
半导体薄膜设备国产化新进展
New Progress in Domestic Production of Semiconductor Thin Film Equipment
张汀 上海积塔半导体有限公司总经理助理
Ting Zhang, General Manager Assistant, GTA Semiconductor Co., Ltd.
15:50-16:10
集成电路物理气相沉积设备研发与产业化
R&D and Industrialization of Physical Vapor Deposition Equipment for Integrated Circuits
程厚义 合肥致真精密设备有限公司董事长/首席技术官
Houyi Cheng, Chairman / CTO, Truth Equipment Co., LTD
16:10-16:30
面向亚3纳米节点的集成电路原子级制造技术矩阵
Atomic-Level Manufacturing Technology Matrix for Sub-3nm Node Integrated Circuits
金一诺 盛美半导体设备(上海)股份有限公司工艺副总裁
Yinuo Jin, Vice President of Process Technology, ACM Research (Shanghai), Inc.
16:30-17:10 圆桌讨论
Panel Discussion
主持人：于大洋
北京诺华资本投资管理有限公司 总经理
Alex Yu, General Manager, Beijing NUO Capital Investment Management Co,Ltd
蒋剑勇 宁波江丰电子材料股份有限公司半导体事业部总经理
Ronnie Jiang, GM, Semiconductor BU, Konfoong Materials International Co., Ltd.
李杰 埃克斯控股（北京）有限公司董事长
Jie Li, Chairman, IKAS Holding (Beijing) Co., Ltd.
汪穹宇 安徽安德科铭半导体科技股份有限公司董事长/总经理
Qiongyu Wang, Chairman/CEO, Anhui ADChem Semi-Tech. Co., Ltd.
邓斌 北京北方华创微电子装备有限公司MDP事业单元总经理
Bin Deng, General Manager, NAURA MDP Business Unit
吴启明 合肥晶合集成电路股份有限公司资深处长
Ryan Wu, Senior Director, Nexchip Semiconductor Corporation
*议程持续更新中，请以现场实际为准
主持人：季宗亮
季华资本创始人、启泰沣华创始人
Zongliang Ji, Founder of Jihua Capital & ChiptestX
13:25-13:30
欢迎致辞
Welcome Address
黄安君 华虹半导体（无锡）有限公司副总裁，无锡市半导体行业协会秘书长
Anjun Huang, Vice President of Hua Hong Semiconductor (Wuxi) Co., Ltd. & Secretary-General of Wuxi Semiconductor Industry Association
13:30-13:50
晶圆与裸片级光学故障定位难点及技术路线图
Wafer and Die Level Optical Fault Localization Challenges and Roadmap
潘福杰 赛美康半导体（无锡）有限公司董事长兼首席执行官
Julian Pan, Chairman & Chief Executive Officer, SEMICAPS China
13:50-14:10
用于缺陷评价的扫描电镜倾斜观察技术
Development of Tilt Observation Technique for Defect Evaluation SEM "CT1000"
袁雍煜 日立高新技术（上海）国际贸易有限公司高级工程师
Yongyu Yuan, Senior Engineer, Hitachi High-Tech (Shanghai) Co., Ltd.
14:10-14:30
从“智能检测”向“智能决策”：AI赋能量检测设备的全新可能
From “Intelligent Inspection” to “Intelligent Decision-Making”: New Possibilities for AI-Empowered Metrology and Inspection Equipment
张雪娜 深圳市埃芯半导体科技有限公司董事长
Xuena Zhang, Chairwoman, Shenzhen Angstrom Excellence Technology Co., LTD
14:30-14:50
化合物半导体全工艺流程的光学量检测方案
Optical Metrology Inspection Solutions for Compound Semiconductor Process
高昆 中电科风华信息装备股份有限公司研发总监
Kun Gao, R&D Director, CETC Fenghua Information Equipment Co., Ltd.
14:50-15:10
东京精密（Accretech）三维封装工艺及散热技术专项技术更新
Accretech technical update for 3D package process and heat dissipation technology
白建星/陆振洲 东精精密设备（上海）有限公司市场部
Jianxing Bai/Zhenzhou Lu, Marketing Planning & Information Dept, ACCRETECH (CHINA) CO., LTD
15:10-15:30
TGV全工艺栈点在线量检测解决方案
TGV Full-Process In-line Metrology & Inspection Solution
张朝前 北京电子量检测装备有限责任公司研发总监
ChaoQian Zhang, R&D Director, Beijing Electronics Inspection and Metrology Equipment Co., Ltd
15:30-15:50
量检测技术赋能先进半导体制造
Enabling Advanced Semiconductor Manufacturing with Metrology & Inspection Technology
曾安生 御微半导体技术有限公司市场总监
Anson Zeng, Marketing Director, Yuwei Semiconductor Technology Co., Ltd
15:50-16:10
AI及先进封装浪潮下重塑存储BI测试新范式：挑战、创新与量产突围
Reshaping The Storage BI Testing Paradigms Amid The AI & Advanced Packaging Wave: Challenges, Innovations and Volume Production Breakouts
王建伟 上海启泰沣华半导体科技有限公司研发副总经理
Jianwei Wang, VP of RD, Shanghai Chiptest Fenghua Semiconductor Technology Co., Ltd.
16:10-17:00 圆桌对话
Panel Discussion
主持人：季宗亮
季华资本创始人、启泰沣华创始人
Zongliang Ji, Founder of Jihua Capital & ChiptestX
王帆 上海御微半导体技术有限公司总裁
Francis Wang, CEO, Shanghai Yuwei Semiconductor Technology Co., Ltd
温任华 魅杰半导体设备（无锡）有限公司董事长
Henry Wen, Chairman, Meijie Semiconductor Equipment (Wuxi) Co., Ltd.
张 峰 江苏芯势科技有限公司董事长
Feng Zhang, Chairman, Jiangsu Semiinnovation Technology Co., Ltd.
张雪娜 深圳市埃芯半导体科技有限公司董事长
Xuena Zhang, Chairwoman, Shenzhen Angstrom Excellence Technology Co., LTD
*议程持续更新中，请以现场实际为准
主持人：张晓燕
盛美半导体设备（上海）股份有限公司工艺资深副总裁
Zhang Xiaoyan, Senior Vice‑President of Process Engineering, ACM Research (Shanghai), Inc.
09:30-09:55
先进湿法清洗工艺技术挑战及发展方向
Challenges in Advanced Wet Cleaning Process Technologies
王文军 盛美半导体设备（上海）股份有限公司工艺副总裁
Wang Wenjun, VP of Process, ACM Research (Shanghai), Inc.
09:55-10:20
面向光电共封装应用的键合技术及演进趋势
Bonding Technologies and Evolution Trends for Co-Packaged Optics Applications
戴风伟 华进半导体先导技术研发中心有限公司资深研发总监
Dai Fengwei, Senior R&D Director, National Center for Advanced Packaging Co., Ltd.
10:20-10:45
先进清洗制程的挑战与ESG贡献
Challenges and ESG Contributions of Advanced Cleaning Process Equipment
李瑞评 扬帆半导体科技(苏州)有限公司首席技术长
Li Ruiping,CTO,Silicar semiconductor technology (Suzhou) Co.,Ltd.
10:45-11:10
半导体装备零部件精密清洗与微污染控制
Precision cleaning and micro contamination control of semiconductor equipment components
张正伟 安徽富乐德科技发展股份有限公司技术总监
Zhang Zhengwei, Technology Director, Ferrotec (An Hui) Technology Development Co.; LTD
11:10-11:35
先进制程用高纯PFA的制备与应用
Preparation and Application of High‑Purity PFA for Advanced Nodes
林榜佳 巨化集团有限公司可熔氟树脂产品经理
Lin Bangjia, Product Manager of Melt‑Processable Fluororesin, Juhua Group Co., Ltd.
*议程持续更新中，请以现场实际为准
主持人：叶乐志 博士
中国电子专用设备工业协会副秘书长
Ye Lezhi, Doctor，Deputy Secretary-General of China Electronic Special Equipment Industry Association
09:30-09:50
多Agent虚拟制造赋能接近式光刻——从计算光刻到智能装备的范式变革
Multi-Agent Virtual Manufacturing Empowering Proximity Lithography: From Computational Lithography to Intelligent Equipment
曹子峥 浙江大学长聘教授/求是特聘教授
Zizheng Cao,Tenured Professor/Qiushi Distinguished, Zhejiang University
09:50-10:10
AI赋能半导体装备高质量发展
AI Empowers High-quality Development of Semiconductor Equipment
巩小亮 中电科电子装备集团有限公司技术总体部主任
Xiaoliang Gong, Director of Overall Technology Department, CETC ELECTRONICS
10:10-10:30
面向AI芯片的先进封装FOPLP与电镀技术的机遇与挑战
Opportunities and Challenges of FOPLP and Electroplating Technologies for Advanced AI Chip Packaging
贾照伟 盛美半导体设备（上海）股份有限公司工艺资深副总裁
Zhaowei Jia, SVP of Process, ACM Research (Shanghai), Inc.
10:30-10:50
AI-Native智能装备：重塑半导体研发与制造新范式
AI-Native Smart Equipment: Reshaping a New Paradigm for Semiconductor R&D and Manufacturing
刘斌 埃克斯控股（北京）有限公司首席技术官 博士
Dr.Bin Liu, IKAS Holdings (Beijing) Co., Ltd.CTO
10:50-11:10
微环控部件与半导体整机协同机制探讨
Discussion on the Collaborative Mechanism between Micro-Environmental Control Components and Complete Semiconductor
李小平 武汉微环控技术有限公司创始人
Xiaoping LI, Founder, Wuhan Micro-Environment Control Co., Ltd.
11:10-11:30
集成电路产业人才需求报告及上海电机学院人才培养现状
Research Report on Talent Demand in the Integrated Circuit Industry and the Current Status of Talent Cultivation at Shanghai Dianji University
刘娜 上海电机学院教授、产业发展研究中心集成电路产业负责人
NA LIU, Professor, Head of the Integrated Circuit Industry Division at the Industrial Development Research Center
11:30-11:50
IBM 如何以混合云与 AI 算力解锁半导体“智造”新范式
Unlocking the New Smart Manufacturing Paradigm in Semiconductors: IBM's Hybrid Cloud & AI Compute Approach
庞文峥 IBM 大中华区存储产品经理
Wenzheng Pang, GCG Storage Product Manager, IBM
*议程持续更新中，请以现场实际为准
主持人：易海兰
张江实验室专家项目经理
Hailan Yi，Expert PM of ZJLAB
09:30-09:50
先进封装设备赋能异构集成新生态
Advanced Packaging Equipment: Eabling the Future of Heterogeneous Integration
耿波 北京北方华创微电子装备有限公司POP事业单元总经理
Bo Geng, General Manager of the POP Business Unit, Beijing NAURA Microelectronics Equipment Co.,Ltd.
09:50-10:10
晶圆键合技术驱动三维集成发展
Wafer Bonding Technology Driving 3D IC Innovation
郭万里 拓荆键科（海宁）半导体设备有限公司总经理
Wanli Guo,CEO,Piotech (Haining) Semiconductor Equipment Co.,Ltd.
10:10-10:30
从装备到工艺：先进键合技术赋能异质集成规模化落地
From Equipment to Process: Advanced Bonding Technologies Enabling High-Volume Manufacturing of Heterogeneous Integration
母凤文 青禾晶元半导体科技（集团）有限责任公司创始人兼董事长
Fengwen Mu, Founder & Chairman, iSABers Group Co.,Ltd.
10:30-10:50
Hybrid Bonding: Enabling Tomorrow's Semiconductor Architectures
Dr. Bernd Dielacher, Business development director, EV Group
10:50-11:10
易卜COORS®-V硅桥先进封装技术对键合技术的要求
Bonding Technology Requirements for Yibu’s COORS®-V Silicon Bridge Packaging Technology
黎明 上海易卜半导体有限公司研发副总
Ming Li, VP R&D, Shanghai Yibu Semiconductor Co. Ltd.
11:10-11:30
芯堆叠·键未来：先进封装中键合与解键合的核心技术突破
Chip Stacking · Bonding the Future: Core Technological Breakthroughs in Bonding & Debonding for Advanced Packaging
王茂林 博纳半导体设备（浙江）有限公司工艺研发总监
Forest Wang, Process Development Director, Bona Semiconductor Equipment (Zhejiang) Co.,Ltd
11:30-11:50
三维集成-后摩尔时代芯片新趋势
3D IC – New Trends of IC in the Post-Moore Era
杨列勇 物元半导体技术（青岛）有限公司联合创始人和首席科学家
Lieyong Yang, Co-Founder & Chief Scientist, Wuyuan Semiconductor Technology (Qingdao) Co.,Ltd.
*议程持续更新中，请以现场实际为准
上午场/Morning Session
09:45-10:00 开幕致辞
Opening Remarks
10:00-10:15
迈向全球增长新格局：算力重塑下的芯片、主权与全球贸易
Entering a new global growth regime: Chips, sovereignty, and trade
卢姿蕙 牛津经济研究院 亚太首席经济学家
Louise Loo, Head of Asia Economics, Oxford Economics
10:15-10:30
AI 新周期：硅片产业机遇与西安奕材产业担当
New AI Cycle: Silicon Wafer Industry Opportunities and Xi'an ESWIN Materials' Industrial Responsibility
杨新元 西安奕斯伟材料科技股份有限公司董事长
Yang Xinyuan, Chairman of Xi'an ESWIN Materials Technology Co., Ltd.
10:30-10:45
先进技术和高生产力双轮驱动半导体工艺设备发展
Dual-wheel Drive of Advanced Technology and High Productivity Promotes the Development of Semiconductor Process Equipment
刘二壮 普达特科技有限公司董事长/CEO
Liu ErZhuang, Chairman/CEO of Productive Technologies Company Limited
10:45-11:00
中国设备产业本土化的2.0版发展目标
The development goal of the 2.0 version of China's equipment industry localization
陈捷 盛红晔半导体董事长
Jay Jie Chen, Chairman of Britech Semiconductor
11:00-11:45
圆桌讨论Ⅰ: 如何实现合作共赢，打造健康的供应链体系
Panel Discussion Ⅰ: How to Achieve Win-Win Cooperation and Build a Healthy Supply Chain
主持人：沈翊
泓明供应链集团董事长
Sysy Shen, Chairman of HMG Supply Chain Group
何小龙 华润微电子有限公司董事长
He xiaolong, Chairman of China Resources Microelectronics Limited
白鹏 华虹宏力半导体有限公司董事会主席兼总裁
Baipeng, Chairman and President of Hua Hong Grace Semiconductor Limited
陈吉 北京北方华创微电子装备有限公司总裁
Ji Chen, President of Beijing NAURA Microelectronics Equipment Co., Ltd.
刘二壮 普达特科技有限公司董事长/CEO
Liu ErZhuang, Chairman/CEO of Productive Technologies Company Limited
陈捷 盛红晔半导体董事长
Jay Jie Chen, Chairman of Britech Semiconductor
11:45-11:50 幸运抽奖
Lucky Draw
下午场/Afternoon session
13:15-13:30
AI——半导体产业的发动机
AI - Motor of the Semiconductor Industry
奥泰因·赫尔佐格 中国工程院外籍院士、德国国家工程院院士、同济大学教授
Otto Heinrich Herzog, Foreign Member of the Chinese Academy of Engineering; Member of the National Academy of Science and Engineering (Acatech, Germany); Professor of Tongji University
13:30-13:45
俄中半导体设备制造领域：学术科研、工业界与高校的战略伙伴关系
Russia and China in Semiconductor Equipment Manufacturing: Strategic Partnership of Academic Science, Industry, and Universities
戈尔巴采维奇•亚历山大 科学院正式成员
Aleksandr Gorbatsevich, Full member of RAS
13:45-14:00
晶圆制造设备的趋势分析：人工智能、制造复杂度与中国的崛起
The Future of Wafer Fab Equipment: AI, Manufacturing Complexity, and China's Rise
Gary Huang Yole集团公司副总裁、亚太区研究与业务开发负责人
Gary Huang, Corp VP, Head of Asia Pacific, Research and Business Development at Yole Group
14:00-14:15
协作融合构建高韧性的半导体产业链
Collaborative Integration to Build a Highly Resilient Semiconductor Industry Chain
徐晏清 霍尼韦尔工业测量与控制大中华区总经理
Rebecca Xu, General Manager Greater China of Honeywell Industrial Measurement & Control
14:15-14:30
RISC‑V 构建未来开放的计算生态
RISC-V is shaping the future open computing ecosystem
彭剑英 芯来智融半导体科技（上海）股份有限公司总裁
Peng Jianying, President of Nuclei System Technology Co.,Ltd.
14:30-14:45
基于系统工程的深紫外光刻物镜设计与制造关键技术
Key Technologies for Design and Manufacturing of Deep Ultraviolet Lithography Objective Lens Based on Systems Engineering
高安 上海米莱芯程半导体有限公司CEO
Gao An, CEO of Shanghai MILEX Semiconductor Co.,Ltd.
14:45-15:00
AI芯片先进封装发展与测试技术研究
Research on Development and Testing Technology of Advanced Packaging for AI Chips
钟锋浩 杭州长川科技股份有限公司董事、副总经理
Zhong Fenghao, Director and Deputy General Manager of Hangzhou Changchuan Technology Co.,Ltd.
15:00-15:15
关键尺寸量测装备国产化：CD-SEM引领产业协同创新
Advancing Domestic Critical Dimension Metrology Equipment: How CD-SEM Drives Collaborative Innovation Across the Semiconductor Value Chain
王志刚 惠然微电子技术（无锡）有限公司董事长
Zeno Wang, Chairman of Wellrun Microelectronics Technology Co.,Ltd.
15:15-15:30
从芯片到智能系统：质量管理的下一次跃迁
From Chips to Intelligent Systems: The Next Leap in Quality Management
陈宇晓 亚旗集团CEO
David Chen, CEO of ACCU Group
15:30-15:45
全球专利地图视角下的半导体产业发展趋势
Trends in the Development of the Semiconductor Industry from a Global Patent Map Perspective
康纳蔚 美国亚司特博钦律师事务所合伙人
Mr. Kyle R. Canavera, Partner of Ashurst Perkins Coie
15:45-16:00
演讲主题待定
Speech Topic: To Be Announced
Meryem KABBADJ 摩洛哥投资与出口发展局（AMDIE）航空航天与电子部主管
Meryem KABBADJ, Head of Aerospace & Electronics Department of Moroccan Investment and Export Development Agency — AMDIE
16:00-16:15
日本及全球半导体产业与制造设备中期需求预测
Medium-term Demand Forecast for the Semiconductor Industry and Manufacturing Equipment in Japan and Worldwide
Tommy Sato 日本半导体设备协会副秘书长
Tommy Sato, Deputy Secretary General of Semiconductor Equipment Association of Japan
16:15-17:00
圆桌对话：如何实现全球半导体产业协作融合
Panel Discussion II: How to Achieve Global
Semiconductor Industrial Collaboration
and Integration
主持人：于治
中合联创（大连）资产管理有限公司创始合伙人
Moderator: Nick Yu, Founding Partner of Zhonghe Lianchuang (Dalian) Asset Management Co., Ltd.
Roger Costa 加泰罗尼亚半导体联盟负责人
Roger Costa, Head of Catalonia Semiconductor Alliance
张哲伟 爱尔兰投资发展局中国区总监
Jervy Zhang, Director China of IDA Ireland
Tadhg O’Callaghan 爱尔兰贸易与科技局大中国区负责人
Tadhg O’Callaghan, Director of Enterprise Ireland for Greater China
杜晶 阿联酋迪拜国际自由区管理局中国区商务代表
Robin Du, China Business Representative of International Free Zone Authority(IFZA)
李可道 马波斯（上海）测量设备科技有限公司大中华区总裁
Riccardo Budries, CEO of Marposs (Shanghai) Technologies Co., Ltd.
马清海 SMC自动化有限公司总经理
Ma Qinghai, General Manager of SMC Automation China Co., Ltd.
王志刚 惠然微电子技术（无锡）有限公司董事长
Zeno Wang, Chairman of Wellrun Microelectronics Technology Co., Ltd.
李昌哲 意创科技有限公司执行董事，航菱微(泰州)科技有限公司常务副总
CJ Li, Executive Director of Exacta Integrated Engineering SDN BHD/ Executive Vice President of Hanglingwei (Taizhou) Technology Co., Ltd.
幸运抽奖
Lucky Draw
*议程持续更新中，请以现场实际为准
主持人：Alexander Alexandrovich Morozov
俄罗斯工业贸易部机床与重型机械工程司无线电电子工业设备开发处顾问
Alexander Alexandrovich Morozov Consultant, the Unit of equipment development for the radio-electronic industry of Department of machine tool and heavy mechanical engineering of Ministry of industry and trade of Russia
09:45-09:50
欢迎致辞
Welcome address
Piven Valery 俄罗斯工业和贸易部机床和重型机械工程司司长
Piven Valery, Director, the Department of Machine Tool and Heavy Mechanical Engineering of Ministry of Industry and Trade of the Russian Federation
09:50-10:00
俄罗斯构建一体化主权电子产品生产体系的复杂方法
Russia's Complex Approach to the Formation of Integrated Sovereign Electronic Product Production
Fatima Konstantinovna Dzodzikova 俄罗斯联邦工业和贸易部机床和重型机械工程司副司长
Fatima Konstantinovna Dzodzikova, Deputy director, the Department of Machine Tool and Heavy Mechanical Engineering of Ministry of Industry and Trade of the Russian Federation
10:00-10:10
为俄罗斯电子工业提供化学品和先进材料的综合方法：从研发到生产
An Integrated Approach to Supplying Russia’s Electronics Industry with Chemicals and Advanced Materials: From Research to Production
Artemyev Alexey 俄罗斯联邦工业和贸易部化学工业司副司长
Artemyev Alexey, Deputy director, the Department of Chemical Industry of the Ministry of Industry and Trade of the Russian Federation
10:10-10:20
一系列俄罗斯用于半导体材料生长和加工的设备和技术的展示
Presentation of a series of Russian equipment and technologies for growing and processing semiconductor materials
Andreev Dmitry “LASSARD”有限责任公司商务总监
Andreev Dmitry, Commercial director, Limited Liability Company «LASSARD»
10:20-10:30
俄罗斯光学投影、光刻及电子束光刻设备产品组合推介
Presentation of the Russian equipment portfolio for optical projection, lithography, electron-bean lithography
Kovalev Anatoly 泽列诺格勒纳米技术中心股份公司首席执行官
Kovalev Anatoly, CEO, JSC Zelenograd nanotechnology center
10:30-10:40
用于蚀刻和薄膜沉积的簇状系统
Cluster-type systems for etching and thin-film deposition
Yeritsyan Georgy 精密机械制造研究所研发部主任
Yeritsyan Georgy, Head of the R&D Department Research Institute for Precision Machine Manufacturing
10:40-10:50
用于在最大尺寸为 Æ150 mm 的衬底上生长 A3B5 和 A2B6 化合物的小型化 MBE 和 MOCVD 系统，以及用于微波电子和光子学生产关键工艺操作的晶圆加工设备的展示
Presentation of small-scale production MBE and MOCVD systems for A3B5 and A2B6 compounds growth on substrates up to Æ150 mm, as well as wafer processing equipment for key technological operations for production of microwave electronics and photonics
Alexeev Alexey博士
«Semiconductor Technologies and Equipment»股份有限公司首席执行官
Alexeev Alexey,PhD,CEO,Joint Stock Company «Semiconductor Technologies and Equipment»
10:50-11:00
俄罗斯用于直接无掩模制造电子和光电子器件的增材制造设备
Russian additive equipment for direct maskless fabrication of electronic and optoelectronic devices
Efimov Aleksei 莫斯科物理技术学院总设计工程师
Efimov Aleksei, Сhief design engineer, Moscow Institute of Physics and Technology
11:00-11:10
适用于最大200毫米半导体和蓝宝石晶圆的引入缺陷检测系统，支持从开放式托盘和SMIF托盘进行手动和自动装卸
Introduced-defect inspection system for semiconductor and sapphire wafers up to 200 mm, with manual and automated loading/unloading from open cassettes and SMIF pods
Vorobev Ivan GNTECH有限责任公司商务总监
Vorobev Ivan, Commercial director, GNTECH LLC
11:10-11:20
用于 180–90 nm 技术工艺的光刻胶和浆料
Photoresists and slurries for 180–90 nm technology processes
Varlamov Denis 分子电子研究所特殊材料部主任
Varlamov Denis, Head of Special Materials Department Molecular Electronics Research Institute
11:20-11:30
将先进的多级SRAF优化技术集成到基于传送带的ILT工作流程中，用于光掩模层设计
Toward Integrating Advanced Multilevel SRAF Optimization Techniques into Conveyor-Based ILT Workflow for Photomask Layer Design
Fedorov Igor 俄罗斯储蓄银行执行董事
Fedorov Igor, Executive Director, Sberbank of Russia
*议程持续更新中，请以现场实际为准
主持人：冯黎
集成电路材料创新联合体秘书长、上海硅产业集团总裁助理
Flora Feng, Secretary-General of ICMIC & Assistant to the President of National Silicon Industry Group
13:30-13:40 领导致辞
Welcome Address
陶建中 江苏省半导体行业协会秘书长
Jianzhong Tao, Secretary-General of Jiangsu Semiconductor Industry Association
13:40-14:00
集成电路材料创新联合体IC观察
IC Watch from ICMIC
冯黎博士 集成电路材料创新联合体秘书长、上海硅产业集团总裁助理
Flora Feng, Secretary-General of ICMIC & Assistant to the President of National Silicon Industry Group
14:00-14:20
聚焦光学硅，打通量产路：光子芯片产业化探索与实践
LNOI to Mass Production: Exploration and Practice in Photonic Chip Industrialization
李军 上海交大无锡光子芯片研究院/光子芯谷创新中心总经理
Jun Li, General Manager, Chip Hub for Integrated Photonics Xplore（CHIPX）
14:20-14:40
AI浪潮重塑薄膜沉积设备新机遇
Angstrom Metallization: The Hidden Backbone of AI Infrastructure
韦玮 研微（江苏）半导体科技有限公司商务总监
Woody Wei, Business Development Director, Pioneer Semiconductor Research
14:40-15:00
AI时代带来的衬底材料新机遇
New Opportunities for Silicon Wafers in the AI Era
林明献 上海硅产业集团股份有限公司技术应用副总经理
Ming-Hsien Lin, FAE Vice President, National Silicon Industry Group
15:00-15:20
先进制程刻蚀终点检测系统的新进展
Advances in Etch Endpoint Detection Systems
张黎明 上海车仪田科技有限公司总经理
Liming Zhang, CEO, Shanghai Cheyitian Technology Ltd.
15:20-15:40
集成电路材料检测技术新进展
New Developments in IC Materials Metrology and Inspection
李春华 上海集成电路材料研究院有限公司检测分析事业部主任
Chunhua li, Lab Director, Shanghai Integrated Circuit Materials Research Institute Co., Ltd.
15:40-16:00 茶歇交流
Networking Break
16:00-17:00 圆桌讨论
Round-table Discussion
主持人：花菓
求是缘半导体联盟常务副秘书长，正海资本合伙人
Winston Hua, Executive Deputy Secretary-General, Truth Semi Group & Partner at Royalsea Capital
周逸晟 集成电路材料创新联合体副秘书长、上海集成电路材料研究院创新联合部部长
Yicheng Zhang, Vice Secretary-General of ICMIC & Director of the Joint Innovation Department at Shanghai Institute of IC Materials
唐韩卿 东华大学集成电路校友会秘书长、芯鑫融资租赁集团股份有限公司副总经理
Hanqing Tang, Secretary-General of Donghua University Integrated Circuit Industry Alumni Association & Deputy General Manager of SINO IC LEASING
李军 上海交大无锡光子芯片研究院/光子芯谷创新中心总经理
Jun Li, General Manager, Chip Hub for Integrated Photonics Xplore（CHIPX）
夏前明 夏罗登工业科技（上海）股份有限公司总经理
Tony, General Manager, Schalod Industry Technology (Shanghai) Co.,Ltd
张黎明 上海车仪田科技有限公司总经理
Liming Zhang, CEO, Shanghai Cheyitian Technology Ltd.
韦玮 研微（江苏）半导体科技有限公司商务总监
Woody Wei, Business Development Director, Pioneer Semiconductor Research
*议程持续更新中，请以现场实际为准
主持人：李昌哲
意创科技有限公司执行董事、航菱微(泰州)科技有限公司常务副总
CJ Li, Executive Director of Exacta Integrated Engineering SDN BHD/ Executive Vice President of Hanglingwei (Taizhou) Technology Co., Ltd.
09:20-09:40
《全链数据体系提升跨境供应链韧性》——重点阐述以数据标准化为底座、以“三账五流”框架为基础、以人工智能为引擎的“全链数据体系”构建路径
《Building Cross-Border Supply Chain Resilience Through a Full-Chain Data System》— Focusing on how to build a “full-chain data system” with data standardization as the foundation, the Three-Ledger Accounting and Five-Flow Consistency framework as the core structure, and artificial intelligence as the driving engine
洪世畅 上海泓明供应链集团产品总监
David, Product Director, HMG Supply Chain Group
09:40-10:00
AI+数字孪生驱动AMHS智能化跃迁
AI + Digital Twin: Powering AMHS’s Intelligent Leap
杨海军 合肥欣奕华智能机器股份有限公司副总裁
Yang Haijun, Vice President, Hefei Sineva Intelligent Machine Co., Ltd.
10:00-10:20
埃米时代的量测革命：CD-SEM技术演进、产业趋势与国产电子束装备突围
Metrology Revolution in the Angstrom Era: CD-SEM Evolution, Industry Trends, and the Path Toward Breakthroughs in Domestic Electron Beam Equipment
王志刚 惠然微电子技术（无锡）有限公司董事长
Wang Zeno, Chairman, Wellrun Microelectronics Technology Co., Ltd.
10:20-10:40
微波等离子体—含氟废气（PFCS）高效处理技术
Microwave Plasma – High-efficiency Treatment Technology for Fluorine-containing Exhaust Gas (PFCS)
周益斌 致和半导体设备（江苏）有限公司首席技术官
Zhou Yibin,CTO,Firsquare Semiconductor Equipment (Jiangsu) Co., Ltd.
10:40-11:00
半导体设备核心电源技术发展的探索与实践
Exploration and Practice of Core Power Supply Technology Development for Semiconductor Equipment
尹向阳 广州金升阳科技有限公司董事长
George,Chairman,MORNSUN Guangzhou Science & Technology Co.,Ltd.
11:00-11:20
新施诺50Kg重载PLP OHT：破局先进封装物流瓶颈，赋能AI算力规模化释放
Xinshino's 50kg-Class PLP-Dedicated OHT: Breaking the Advanced Packaging Logistics Bottleneck to Enable AI Computing Power at Scale
路通 苏州新施诺半导体设备股份有限公司技术副总经理
Lu Tong, Deputy General Manager of Technology, Suzhou Xinshinuo Semiconductor Equipment Co.,Ltd
11:20-11:40
先进封装关键装备及核心技术突破
Key Equipment and Core Technology Breakthroughs in Advanced Packaging
喻杰 迈为技术（珠海）有限公司副总经理兼总经理特助
Yujie, Deputy GM & Exec. Asst. to GM, Maxwell Technologies (Zhuhai) Co.,Ltd.
11:40-12:00
晶圆键合及国产设备的挑战和突破
Wafer Bonding: Challenges and Breakthroughs in Domestic Equipment
曲鲁杰 深圳市克洛诺斯科技有限公司高级技术顾问
Qu Lujie, Senior Technical Advisor, Shenzhen Cronus Technology Co., Ltd.
12:10-13:30 午餐&休息
Lunch & Break
*议程持续更新中，请以现场实际为准
主持人：裴大章
中国电子专用设备工业协会监事
Pei Dazhang, Supervisor, China Electronic Special Equipment Industry Association
13:30-13:55
世界最大微振动模拟振动台的性能与应用
Performance and Applications of the World’s Largest Micro-vibration Shaking Table
冯德民 中国电子工程设计院股份有限公司日本工程院院士，国投集团首席专家
HYOU TOKUMIN, Member, The Engineering Academy of Japan & Chief Expert at SDIC Group, China Electronics Engineering Design Institute CO., LTD.
13:55-14:20
国产量检测精密运动台：不止替代，更敢领跑
Domestic Precision Motion Stages for Metrology & Inspection: Beyond Replacement, Leading the Race
赵磊 江苏集萃苏科思科技有限公司量检测与光刻事业部总经理
Zhao Lei, Jiangsu JITRI SKS Technologies Co., Ltd.
14:20-14:45
制程之困，光束为解：半导体精密制造的激光新路径
Breaking Process Barriers with Laser: New Frontiers in Semiconductor
刘超 优耐特高精（上海）机床有限公司产品经理
Liu Chao, Production Manager of CHARMILLES, United Machining
14:45-15:10
工艺驱动・厂机协同 —— 半导体设备与洁净厂房一体化设计之路
Process-Driven, Fab & Equipment Synergy —— The Integrated Design Path of Semiconductor Equipment and Cleanroom Facilities
占鹏飞 中国电子系统工程第二建设有限公司电子行业中心副主任
Zhan Pengfei, Deputy Director Electronics Industry Center, China Electronics System Engineering No.2 Construction Co., Ltd.
15:10-15:35
从半导体温控设备看当前的课题与今后的方向
Looking at current issues and future directions from the perspective of semiconductor temperature control equipment
王雨 鸿世佰熠半导体设备（上海）有限公司联合创始人
Wang Yu, Co-founder, Hongshibaiyi Semiconductor Equipment (Shanghai) Co., Ltd.
15:35-16:00
聚焦核心零部件 助力半导体行业发展
AURASKY core components support the development of the semiconductor industry
王弘 北京华丞电子股份有限公司解决方案行销中心总监
Wang Hong, Director of Solution Marketing Center, Beijing AURASKY Electronics Co., Ltd.
16:00-16:25
大尺寸SiC减薄解决方案
Large-format SiC Grinding Solutions
梁津 北京中电科电子装备有限公司产品研发部部长
Jessie Liang, Products R&D Department Minister, CETC BEIJING ELECTRONIC EQUIPMENT CO.LTD
16:25-16:50
发那科智能智造驱动半导体产业降本、提质、增效
Fanuc Intelligent Manufacturing Drives Cost Reduction, Quality Improvement, and Efficiency Enhancement in the Semiconductor Industry
徐运华 上海发那科智能机械有限公司销售经理
Xu Yunhua, Sales Manager, SHANGHAI-FANUC Robomachine Co., Ltd.
*议程持续更新中，请以现场实际为准
主持人：石瑛
集成电路材料产业技术创新联盟秘书长
Ingrid Shi, Secretary General of ICMtia
14:00-14:10 领导致辞
Welcome Address
14:10-14:30
半导体零部件用CVD装备技术及应用
Technology and Application of CVD Equipment for Semiconductor Components
田冬龙 山西中电科电子装备有限公司副总经理兼涂层事业部部长/技术总监/高级工程师
Donglong Tian, Deputy General Manager, Minister & Technical Director of Coating, Shanxi CETC Electronic Equipment Co., Ltd.
14:30-14:50
国产CMP零部件与材料的解决方案
Solutions for Domestic CMP Parts and Materials
惠宏业 上海润平电子材料有限公司总经理
Richard Hui, General Manager, Shanghai RunPin Electronic Materials Co.,Ltd.
14:50-15:10
先进陶瓷材料和核心零部件在半导体装备中的应用
Application of Advanced Ceramic Materials and Core Components in Semiconductor Equipment
刘先兵 苏州珂玛材料科技股份有限公司董事长兼总经理
Xianbing Liu，Chairman & General Manager，Suzhou Kema Materials Technology Co., Ltd.
15:10-15:30
半导体设备用石墨零部件国产化进展
Progress in the Localization of Graphite Components for Semiconductor Equipment
周明 赛迈科先进材料股份有限公司总经理
Ming Zhou, General Manager, SIAMC Advanced Materials Co., Ltd.
15:30-15:50
全球半导体设备与气流场零部件发展新趋势
Emerging Trends in Global Semiconductor Equipment and Gas Flow Field Components
杨绍辉 星奇（上海）半导体有限公司副总经理
Shaohui Yang, Deputy General Manager, Xingqi (Shanghai) Semiconductor Co., Ltd.
15:50-16:10
集成电路用氟聚合物研发与应用进展
Advances in Research and Application of Fluoropolymers for Integrated Circuits
孟庆文 浙江巨化股份有限公司氟聚合物事业部总工程师
Qingwen Meng, Chief Engineer of Fluoropolymer Division, Juhua Co., Ltd.
16:10-16:30
自主可控 PTFE膜材与全氟滤芯，赋能先进制程国产替代
Autonomous and controllable PTFE membrane materials and perfluorinated filter elements empower domestic substitution in advanced manufacturing processes
阙俏颖 飞潮（上海）新材料股份有限公司应用技术总监
Qiaoyin Que, Director of Application Technology, Feature-Tec (Shanghai) Advanced Materials Co., Ltd.
16:30-16:50
国内集成电路材料产业发展情况
Development of Domestic‑Based Integrated Circuit Materials Industry
集成电路材料产业技术创新联盟
ICMtia
16:50-17:20
06专项“集成电路关键原辅材料”项目与标准宣贯
Promotion and Implementation of Projects and Standards Under the 06‑Major Project — Key Raw and Auxiliary Materials for Integrated Circuits
集成电路材料产业技术创新联盟
ICMtia
*议程持续更新中，请以现场实际为准
主持人：林建
中国电子材料协会半导体材料分会秘书长
Lin Jian, Secretary-General of the Semiconductor Materials Branch, CEMIA; Former Chief Expert, CETC 46th Research Institute
09:30-09:55
应用导向的晶片材料技术
Technology of Application-oriented Silicon Wafers
李文中 上海合晶硅材料股份有限公司 首席技术官、副总经理
Dr. Li Wenzhong -Chief Technology Officer, Vice General Manger, Wafer Works Co.(Shanghai)
10:00-10:20
集成电路大硅片的发展趋势
Development Trends of Large Silicon Wafers for Integrated Circuit Applications
张俊宝 上海超硅半导体股份有限公司总监
Dr. Junbao Zhang, CTO, Shanghai Advanced Silicon Technology Co., Ltd.
10:25-10:45
磷化铟衬底介绍
Introduction on Indium Phosphide (InP) Substrate
任殿胜 北京通美晶体技术股份有限公司技术总监
Dr. Diansheng Ren, Director of Beijing Tongmei Crystal Technology Co., Ltd.(AXT Inc.)
10:50-11:10
高质量大尺寸氧化镓衬底晶圆的进展与挑战
Progress and Challenges of High-Quality Large-Diameter Gallium Oxide Substrate Wafers
张辉 杭州镓仁半导体有限公司董事长
Mr. Hui Zhang, Chairman, Hangzhou Garen Semiconductor Co., Ltd.
11:15-11:35
氮化铝超宽禁带半导体材料发展现状及趋势研究
Research on Development Status and Trend of Aluminum Nitride Ultra-Wide Bandgap Semiconductor Materials
解楠 中国电子信息产业发展研究院集成电路研究所化合物半导体研究室主任
Mr.Nan Xie -Director and Senior Engineer,the Compound Semiconductor Research Office at the Integrated Circuit Research Institute, China Electronics Information Industry Development Research Institute
11:40-12:00
晶圆级金刚石研究进展
Research Progress of Wafer-Scale Diamond
兰飞飞 中国电子科技集团公司第四十六研究所研究员、专家
Dr. Feifei Lan, Expert,the 46th Research Institute of China Electronics Technology Group Corporation
*议程持续更新中，请以现场实际为准
主持人：孙斌
西电上海校友会执行副会长
Sun Bin, Executive Vice President, Shanghai Alumni Association of Xidian University
14:05-14:30 领导致辞
Welcome Address
赵晋荣 中国电子专用设备工业协会荣誉理事长
Zhao Jinrong, Honorary Chairman, China Association for Electronic Special Equipment Industry
张玉明 西电微电子行业校友会理事长
ZhangYuming, Chairman, Microelectronics Alumni Association of Xidian University
李警 西安电子科技大学校友总会副处长
Li Jing, Deputy Director, Alumni Association of Xidian University
张永刚 西安电子科技大学无锡校友会会长
Zhang Yonggang, President, Wuxi Alumni Association of Xidian University
14:30-14:50
西电集成电路学部介绍、科技成果展示
About the Faculty of Integrated Circuits, Xidian University & Showcase of Scientific and Technological Achievements
肖刚 西安电子科技大学集成电路学部党委书记
Xiao Gang, Party Secretary, Faculty of Integrated Circuits, Xidian University
14:50-15:00
西电集成电路学部十大校企合作项目发布
Release of Ten University-Enterprise Cooperation Projects, Faculty of Integrated Circuits, Xidian University
肖刚 西安电子科技大学集成电路学部党委书记
Xiao Gang, Party Secretary, Faculty of Integrated Circuits, Xidian University
15:00-15:20
半导体产业发展趋势与机会-盛景微实践之路
Semiconductor Industry Development Trends & Opportunities — The Practice Path of Holyview
张永刚 无锡盛景微电子股份有限公司董事长
Zhang Yonggang, Chairman,Wuxi Holyview Microelectronics Co., Ltd.
15:20-15:40
后摩尔时代:华为韬定律与中国半导体投资机遇
Post-Moore Era: Huawei’s Tao Law and Investment Opportunities in China’s Semiconductor Industry
谢建友 齐力半导体(绍兴)有限公司董事长
Xie Jianyou, Chairman, Qili Semiconductor (Shaoxing) Co., Ltd.
15:40-16:00
AI驱动下的硅光集成工艺发展介绍
AI-Driven Development of Silicon Photonics Integration Processes
胡鑫 联合微电子中心有限责任公司市场负责人
Hu Xin, Marketing Lead, United Microelectronics Center Co., Ltd.
16:00-16:15
蓝宝石基GaN的优异特性以及器件在AIDC和新能源领域的应用
Excellent Properties of Sapphire-Based GaN and Device Applications in AIDC and New Energy Fields
白俊春 上海格晶半导体有限公司董事长
Bai Junchun, Chairman, Shanghai Gejing Semiconductor Co., Ltd.
16:15-16:30
超宽禁带氧化镓半导体外延材料与器件
Ultra-Wide Bandgap Gallium Oxide Semiconductor Epitaxial Materials and Devices
彭博 镓创未来半导体科技(晋江)有限公司董事长
Peng Bo, Chairman, Gallium Future Semiconductor Technology (Jinjiang) Co., Ltd.
16:30-16:45
金刚石MPCVD生长和电子器件应用
MPCVD Growth of Diamond and Its Applications in Electronic Devices
任泽阳 西安电子科技大学微电子学院教授
Ren Zeyang, Professor, School of Microelectronics, Xidian University
16:45-17:00
砺铸智能:用"芯"创造美好生活
LIZHU INTELLIGENT: Create a Better Life with Chips
唐亮 砺铸智能设备有限公司董事长/总经理
Tang Liang, Chairman & General Manager, Lizhu Intelligent Equipment Co., Ltd.
17:00-17:30
自由交流/合影留念
Free Discussion & Group Photo Session
*议程持续更新中，请以现场实际为准
主持人：杨俊
集团副总裁，人力资源，中微半导体设备（上海）股份有限公司
Yang Jun, Group Vice President, Human Resources,Advanced Micro-Fabrication Equipment Inc. China
13:00-13:30
中微公司2027企业人才需求发布
2027 Corporate Talent Demand Announcement of AMEC
杨俊 集团副总裁，人力资源，中微半导体设备（上海）股份有限公司
Yang Jun, Group Vice President, Human Resources, Advanced Micro-Fabrication Equipment Inc. China
13:30-14:00
北方华创2027校招宣讲
2027 Campus Recruitment Presentation of NAURA
王铮 高校关系总监，北京北方华创微电子装备有限公司
WangZheng, Director, Beijing NAURA Microelectronics Equipment Co.,Ltd.
14:00-14:20
拓荆科技文化传承与人才发展理念
Piotech：Cultural Heritage and Talent Development Philosophy
马俊 人力资源部总监，拓荆科技股份有限公司
Ma Jun, Director, Piotech, Inc
14:20-14:30
掌控温度，定义精度——与奥德一起，做半导体温控制造的“隐形冠军”
Master temperature, define precision — with Aode, be the hidden champion in semiconductor temperature control manufacturing
颜洁 人力资源部总监 苏州奥德高端装备股份有限公司
Yan Jie,Director,Suzhou AODE Precise Equipment Co., Ltd.
14:30-14:40
康姆艾德公司介绍和人才发展
Comet Company Introduction and Talent Development
王灿灿/孙伟 销售/招聘 康姆艾德机械设备（上海）有限公司
Wang Vanessa /Sun Dean, Sale/HR, COMET
14:40-14:50
破局与突围：半导体设备企业人才战略的升级之路
Talent Strategy 2.0: Breaking Through for Semiconductor Equipment Players
绳欣航 招聘主管 北京电子量检测装备有限责任公司
Sheng Winnie, HR Manager, Beijing Electronics Inspection and Metrology Equipment Co., Ltd.
14:50-15:00
精密制造，最缺人：佰控的人才观与行业机会
"Precision Manufacturing Faces Its Biggest Talent Crunch: BICCNS Talent Philosophy and Industry Opportunities"
丁杨 人事经理 苏州佰控传感技术有限公司
Ding Yang, HR Manager, BICCNS
15:00-15:10
"恒"等你来，遇见不一样的自己
Join CSL, Discover a Better Version of Yourself
郭东霞 HRD 深圳市恒运昌真空技术股份有限公司
Guo Rachel, HRD, Shenzhen CSL Vacuum Science And Technology Co., Ltd.
*议程持续更新中，请以现场实际为准
09:20-09:30 领导致辞
Welcome Address
09:30-09:50
微机电能源（MEME）热电芯片
Micro-Electromechanical Energy (MEME) Thermoelectric Chip
胡志宇教授 上海交通大学张江高等研究院
Hu Zhiyu, Professor, Zhangjiang Institute for Advanced Study, Shanghai Jiao Tong University
09:50-10:10
MEMS基智能气体传感器
MEMS-based Intelligent Gas Sensors
徐甲强教授 上海大学理学院
Xu Jiaqiang, Professor, College of Sciences, Shanghai University
10:10-10:30
新型存储器技术与芯片安全设计
Novel Memory Technology and Chip Security Design
詹学鹏教授 山东大学信息科学与工程学院
Zhan Xuepeng, Professor, School of Information Science and Engineering, Shandong University
10:30-10:50
新一代半导体关键金属高纯镓的制备技术
Preparation Techniques for High-Purity Gallium as a Critical Metal in Next-Generation Semiconductor Applications
厉英教授 东北大学冶金学院
Li Ying, Professor, School of Metallurgy, Northeastern University
10:50-11:10
超高孔隙率实心骨架泡沫铜及其三明治结构材料
Ultra-High Porosity Solid-Skeleton Copper Foam and Its Sandwich Structure Material
肖健博士 江西理工大学材料学院
Xiao Jian, Dr., School of Materials Science and Engineering, Jiangxi University of Science and Technology
11:10-11:30
碳化硅衬底激光改质剥离技术研究
Research on Laser Modification and Lift-off Technology of SiC Substrates
陆喜文助理研究员 中国科学院宁波材料技术与工程研究所
Lu Wenxi, Assistant Researcher, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences
11:30-11:50
高能效低成本端侧算力芯片（ReCIM5501）
High-Efficiency and Low-Cost Edge Computing Chip (ReCIM5501)
马奕涛教授 浙江大学集成电路学院
Ma Yitao, Professor, College of Integrated Circuits, Zhejiang University
11:50-12:10
硬科技成果转化视角下：技术转移复合型人才的培养路径与实践
From the Perspective of Hard-Tech Commercialization: Cultivation Pathways and Practices for Interdisciplinary Talent in Technology Transfer
侯家佳 复旦大学技术转移硕士项目主任
Hou Jiajia, Program Director, MTT Program, Fudan University
12:10-13:30 午餐&休息
Lunch & Break
13:30-13:50
半导体工艺优化大模型
Large Model for Semiconductor Process Optimization
熊红凯教授 华东师范大学信息与电子工程学院
Xiong Hongkai, Professor, School of Information and Electronic Engineering, East China Normal University
13:50-14:10
太赫兹半导体无损检测
Terahertz Semiconductor Non-destructive Testing
胡旻教授 电子科技大学电子科学与工程学院
Hu Min, Professor, School of Electronic Science and Engineering, University of Electronic Science and Technology of China
14:10-14:30
金刚石 MPCVD 生长和电子器件应用
MPCVD Growth of Diamond and Its Applications in Electronic Devices
任泽阳教授 西安电子科技大学微电子学院
Ren Zeyang, Professor, School of Microelectronics, Xidian University
14:30-14:50
半导体级先进气体流量测控传感器及仪表技术研究
Research on Semiconductor-Grade Advanced Gas Flow Measurement and Control Sensors and Instrumentation Technology
田伟博士 山东大学信息科学与工程学院
Tian Wei, Dr., School of Information Science and Engineering, Shandong University
14:50-15:10
实时反馈原子级半导体TCAD
Atomic-Level Semiconductor TCAD with Real-Time Feedback
陈竞哲副教授 上海大学理学院
Chen Jingzhe, Associate Professor, School of Sciences, Shanghai University
15:10-15:30
基于国产芯片&英伟达GPU硬件平台多节点多卡并行软件开发技术
Multi-Node Multi-GPU Parallel Software Development on Domestic Chips and NVIDIA GPU Platforms
张岩教授 重庆理工大学车辆工程学院
Zhang Yan, Professor, School of Vehicle Engineering, Chongqing University of Technology
15:30-15:50
半导体先进封测关键设备技术研究最新进展
Latest Advances in Key Equipment Technologies for Semiconductor Advanced Packaging and Testing
叶乐志 北京工业大学 半导体高端装备研究所所长
Ye Lezhi, Director, Institute of Advanced Semiconductor Equipment, Beijing University of Technology
15:50-16:10
光学精密制造设备研发与光波导应用技术
R&D of Optical Precision Manufacturing Equipment and Applied Technology for Optical Waveguides
葛爱明教授 复旦大学智能机器人与先进制造创新学院
Ge Aiming, Professor, School of Intelligent Robotics and Advanced Manufacturing, Fudan University
16:10-16:30
高精度电-热协同表征平台（ET-1000）
High-Precision Electro-Thermal Co-Characterization Platform (ET-1000)
李骏康教授 浙江大学集成电路学院
Li Junkang, Professor, College of Integrated Circuits, Zhejiang University
16:30-16:50
双偏振-双域融合光纤模式分解与偏振态智能测量系统
Dual-Polarization and Dual-Domain Fusion Fiber Mode Decomposition and Intelligent Polarization State Measurement System
柴俊宇副教授 杭州电子科技大学理学院
Chai Junyu, Associate Professor, School of Sciences, Hangzhou Dianzi University
*议程持续更新中，请以现场实际为准
主持人：蔡坚
清华大学 研究员
Cai Jian, Researcher, Tsinghua University
09:00-09:40
当值理事长致辞
Incumbent Chairman Speeches
杨之诚 国家集成电路封测产业链技术创新战略联盟当值理事长
Yang Zhicheng,Rotating Chairman, National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategic Alliance
嘉宾致辞
Remarks by Distinguished Guests
施毅 南京大学微电子学院院长 中国科学院院士
Shi Yi, Dean, the School of Microelectronics at Nanjing University; Academician,the Chinese Academy of Sciences
09:40-09:55
国家封测联盟第五届理事会轮值理事长颁发证书
Presentation of the Certificate of Appointment to the Rotating Chair of the Fifth Council of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategic Alliance
国家封测联盟第五届理事会副理事长颁发证书
Presentation of Certificates of Appointment to the Vice Chairs of the Fifth Council of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategic Alliance
09:55-10:20
集成电路前沿进展
Progresses in Frontiers in Microelectronics
刘胜 中国科学院院士 武汉大学工业科学研究院执行院长、集成电路学院院长
Liu Sheng, Academician, the Chinese Academy of Sciences; Executive Dean of the Wuhan University Institute of Industrial Science; Dean of the School of Integrated Circuits
10:20-10:45
封装的演进和未来
Evolution and Future of IC Packaging
杨程 江苏长电科技有限公司科学家
Yang Cheng, Scientist, JCET Group
10:45-11:10
AI算力浪潮下的高速接口封装创新与演进趋势
Trends in innovative high speed-IO packaging driven by AI computing
丁敬峰 通富微电子股份有限公司技术副总
Ding Jingfeng, Tech. VP, TFME
11:10-11:35
新时代先进封装发展趋势和策略
Advanced Packaging Development Trends and Strategies in the New Era
于大全 国家集成电路特色工艺及封装测试创新中心主任 厦门云天半导体科技有限公司创始人
Yu Daquan, Director of the National Innovation Center for Specialized Integrated Circuit Processes and Packaging Testing, Founder of Xiamen Yuntian Semiconductor Technology Co., Ltd.
*议程持续更新中，请以现场实际为准
主持人：高瑞锋 华天科技技术市场中心总监
GAO Ruifeng, Marketing Director, HT-Tech
13:30-13:50
人工智能时代的功率半导体与集成技术
Power Semiconductor and Integration Technology in the AI Era
刘国友 中车科学家、功率半导体与集成技术全国重点实验室副主任、西南交通大学集成电路学院 副院长
Liu Guoyou, CRRC scientist、Deputy Director, National Key Lab of Power Semiconductor and Integration; Associate Dean, School of Integrated Circuits, Southwest Jiaotong University
13:50-14:10
AI应用场景需求推动封装多样化
AI application scenario requirements push various packaging
方家恩 锐杰微科技董事长
Fang Jiaen, chairman, RMT
14:10-14:30
多品类晶圆工艺集成下的封测供应链：MEMS/BCD/硅光跨界协同破局思路
Packaging & Testing Supply Chain Under Multi-Type Wafer Process Integration: MEMS, BCD and Silicon Photonics
严然 广州增芯科技有限公司全球商务中心副总裁
Ruby Yan, Vice president for global, Guangzhou Zen Semiconductor Corporation
14:30-14:50
破解先进封装 VOC 治理痛点，LACO高效吸附低温催化降解一体化解决方案
Solving the pain points in advanced packaging VOC management LACO high-efficiency adsorption and low-temperature catalytic degradation integrated solution
金华 上海揽臻环保科技有限公司技术总监
Jin Hua, Technical Director, Shanghai Lanzhen Environmental Protection Technology Co., Ltd.
14:50-15:10
面向先进封装的超声检测技术创新与国产突破
Innovations and Independent Breakthroughs of Ultrasonic Inspection in Advanced Packaging
段忠福 上海骄成超声波技术股份有限公司董事兼常务副总
Frank Duan, Director & EVP GM, SBT Ultrasonic Technology CO.,LTD
15:10-15:30
提升晶圆键合的减薄解决方案
Optimized Thinning Solutions for Wafer Bonding
冷生辉 北京中电科电子装备有限公司副总经理
Leng Shenghui, ViceGeneral Manager, CETC BEIJING ELECTRONIC EQUIOMENT CO.,LTD.
15:30-15:50
核心装备自主可控：晶圆传送机械手国产化实践与进程
Self-controllable Core Equipment: Practice and Development of Domestic Wafer Transfer Robots
林坚 泓浒（苏州）半导体科技有限公司董事长兼首席技术官
Jacky Lin, Chairman&CTO, Honghu (Suzhou) Semiconductor
15:50-16:10
临港新片区集成电路产业发展介绍
Introduction to the IC Industry Development in Lingang Special Area
曹阳 上海临港新片区国际投资发展有限公司总经理
Cao Yang, General Manager, Shanghai Lin-gang Special Area International Investment & Development Cpo.,Ltd.
16:10-16:30
知识产权服务科技新生态 - 知识产权+科技+资本
The New Ecosystem: Powered by IP × Technology × Capital
陈永岚 金杜长三角知识产权中心负责人
Eddie Chen, Partner, King&Wood Yangtze River Delta IP Centre
*议程持续更新中，请以现场实际为准
主持人：杨剑宏
苏州晶方半导体科技股份有限公司研发部总经理
Bryan Yang, R&D General Manager, China Wafer Level CSP Co., Ltd.
09:20-09:40
高算力芯片封装产能提升的解决方案
A Solution to Boost the Packaging Throughput of HPC Chips
郭垒 华海清科股份有限公司CMP事业部总经理
Lei Guo, General Manager of the CMP Division, Hwatsing Technology Co., Ltd.
09:40-10:00
半导体光学检测技术创新与国产化突破
Technological Innovation and Domestic Breakthrough of Process Optical Inspection in the Full Semiconductor
欧阳嘉诚 珠海诚锋电子科技有限公司产品总监
Owen, Product Director, Zhuhai Chengfeng Electronic Technology Co., Ltd.
10:00-10:20
AI 趋势下 FC-BGA 产品技术演进方向
The technological evolution direction of FC-BGA packaging substrate under the AI trend
李玉龙 广州广芯封装基板有限公司前沿技术研发经理
Yu Long Li, Advanced Technology R&D Manager, GreatTech Substrates Co., Ltd
10:20-10:40
东精精密（Accretech）三维封装工艺及散热技术专项技术更新
Accretech technical update for 3D package process and heat dissipation technology
白建星/陆振洲 东精精密设备（上海）有限公司市场部
Jianxing Bai/Zhenzhou Lu, Marketing Planning & Information Dept, ACCRETECH (CHINA) CO., LTD
10:40-11:00
高精度键合设备设计与制造技术 – 国产设备突破之路
Design and Manufacturing of High-precision wire bonder
李峥嵘 深圳市大族封测科技股份有限公司副总经理 研发总监
Li Zhengrong, Deputy GM, R&D Director, SHENZHEN HAN’S ASSEMBLY AND
11:00-11:20
再定义高功率ATC：AI测试的热控未来
Rethinking High-Power ATC: Thermal Control for the AI Test Era
巩 钰 天津金海通半导体设备股份有限公司技术副总
Gong Yu, VP of Technology, JHT Design Co.,LTD.
11:20-11:40
电子封装关键材料的国产化替代
The Domestic Substitution of Key Electronic Packing Materials
朱顺利 晶丰电子封装材料（武汉）有限公司常务副总裁
Zhu Shunli, Deputy Vice President, EP Materials（Wuhan）Co. Ltd.
11:40-12:00
半导体先进封装材料与工艺协同创新
Co-innovation of Materials and Processes for Advanced Semiconductor Packaging
胡彦杰 铟泰公司中国区技术经理
Hu Leo, Country Technical Manager - China, Indium Corporation
*议程持续更新中，请以现场实际为准
主持人：何洪文
华进半导体封装先导技术研发中心有限公司代总经理
Hongwen He, CEO, National Center for Advanced Packaging Technology
13:25-13:30 致辞
Welcome Address
13:30-13:50
先进封装驱动智能世界发展
AD PKG Drives AI Development
党超强 华天科技总部技术市场中心TPM经理
Leo, TPM, Tianshui Huatian Technology Co., Ltd.
13:50-14:10
中微精密装备，助力先进封装良率新高度
AMEC Precision Equipment Supporting Customers on Advanced Packaging Yield Enhancement
邰利 中微半导体设备（上海）股份有限公司资深业务总监
Li Tai, Business Senior Director, Advanced Micro-Fabrication Equipment Inc. China
14:10-14:30
AI时代光互连与光电共封技术
Optical Interconnection and OE Co-packaging Technology in the AI Era
刘丰满 华进半导体封装先导技术研发中心有限公司副总经理
Fengman Liu, VP, NCAP
15:00-15:20
先进封装中大面积模块的光刻技术
Photolithography Technology for Large-Area Modules in Advanced Packaging
龚里 苏斯贸易 (上海) 有限公司总经理
Li Gong, General Manager, Suss MicroTec(shanghai) LTD
14:50-15:10
AI 赋能先进封装设计新范式：2.5D/3DIC EDA 全流程STCO协同创新
AI-Empowered New Paradigm for Advanced Packaging Design: Full-Flow STCO Collaborative Innovation for 2.5D/3D IC EDA
赵毅博士 珠海硅芯科技有限公司创始人兼总经理
Yi Zhao, Founder and General Manager, Zhuhai Silicon Chip Technology Ltd.
15:10-15:30
服务AI时代的晶圆制造能力
Enabling wafer‑manufacturing capabilities for the AI era
殷海玮博士 上海复享光学股份有限公司创始人 & 总经理
Haiwei Yin, Founder and General Manager, ideaoptics Inc.
15:30-15:50
协同创新，驱动未来：先进封装减薄与切割工艺链的深度融合
Collaborative Innovation, Driving the Future: Deep Integration of Advanced Packaging Grinding and Laser Cutting Process Chains
郭谦 江苏元夫半导体科技有限公司副总经理
Chien Kuo, VP of sales, Leadlap Semiconductor
15:50-16:10
先进封测，精准感知—— 打造传感器封测技术新高地
Advanced Packaging & Testing, Precision Sensing— Forge a New High Ground in Sensor Packaging & Testing Technology
龚黎泉 上海共进微电子技术有限公司市场销售总监
Jiegfried Gong, Shanghai Gongjin Microelectronics Technology Co., Ltd., Marketing&Sales Director
16:10-16:30
国家智能传感器创新中心特色三维异质晶圆工艺
Characteristic 3D Heterogeneous Wafer Process, National Innovation Center for Intelligent Sensors
潘代强 上海芯物科技有限公司中试线负责人
Ted, Head of Pilot Line, Siwave, Inc.
*议程持续更新中，请以现场实际为准
