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晶圆制造/代工


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Foundry市场快讯_20230206

2023/02/06

晶圆制造/代工

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Samsung foundry 4Q22营收以韩圜计算营收较前季增约2.4%,以美元基础换算4Q22营收为US$5.6bn...

供应链库存去化缓慢,客户投片续踩剎车,2023年晶圆代工产值年减4%

2023/01/17

晶圆制造/代工

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根据全球市场研究机构集邦科技TrendForce调查表示,时序进入2023年第一季度,消费性终端迈入淡季,供应链库存去化缓慢...

Foundry市场快讯_20230109

2023/01/09

晶圆制造/代工

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TSMC 12/29于南科Fab18举办3nm量产及P8厂区扩产典礼,宣示自3Q22开始生产的首批3nm晶圆已产出...

Foundry市场快讯_20221226

2022/12/26

晶圆制造/代工

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由于消费性市况疲弱致使客户备货动能冷淡,中系foundry近期祭出优惠或降价措施吸引新旧客户...

地缘政治风险延烧,美系终端品牌启动去中化策略,带动Foundry转单效应

2022/12/14

晶圆制造/代工

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根据全球市场研究机构集邦科技TrendForce调查表示,在《芯片法案》(The CHIPS+ Act)与美商务部对中最新禁令(New Export Controls)相继颁布并生效后...

Foundry市场快讯_20221212

2022/12/12

晶圆制造/代工

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关于TSMC Arizona Fab21,呈TrendForce于2022/11/14出刊的market bulletin当中提及,该厂共规划六期(phase)...

Overview of Semiconductor Subsidy Policies

2022/12/09

晶圆制造/代工

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1. European Chips Act
2. US Subsidy Policies
3. Japan Subsidy Policies
4. Partnership between Japan and the US
5. LSTC
6. Cooperation Framework and Organization of Rapidus
7. Strategy for Future Development and Cooperation
8. Conclusion

Overview of Semiconductor Subsidy Policies

2022/12/09

晶圆制造/代工

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1. European Chips Act
2. US Subsidy Policies
3. Japan Subsidy Policies
4. Partnership between Japan and the US
5. LSTC
6. Cooperation Framework and Organization of Rapidus
7. Strategy for Future Development and Cooperation
8. Conclusion

iPhone新机带动3Q22前十大晶圆代工产值季增6%,惟产值已攀顶峰下行风暴将至

2022/12/05

晶圆制造/代工

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根据全球市场研究机构集邦科技TrendForce调查显示,随着供应链进入库存修正期,终端及芯片厂目标将库存消化至疫情前健康水位...

Foundry市场快讯_20221128

2022/11/28

晶圆制造/代工

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从资本支出观察,在目前晶圆代工需求转弱的市况下,Samsung Foundry在2023年规划约US$14-15bn资本支出预算,仍较2022年成长...